Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP3135363
Kind Code:
B2
Inventors:
Tomizo Sawada
Tomohiro Kume
Tomohiro Kume
Application Number:
JP15325592A
Publication Date:
February 13, 2001
Filing Date:
June 12, 1992
Export Citation:
Assignee:
Matsushita Electronics Industrial Co., Ltd.
International Classes:
H01L27/04; H01L21/822; H01L21/8222; H01L27/06; (IPC1-7): H01L27/06; H01L21/822; H01L21/8222; H01L27/04
Domestic Patent References:
| JP60109244A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)