Title:
【発明の名称】多孔性半導体処理コンポネントの浸漬試験
Document Type and Number:
Japanese Patent JP3231329
Kind Code:
B2
Abstract:
To permit immersion ultrasonic testing of a semiconductor processing component manufactured of porous metal, a cover is sealed over the processing surface of the component. The cover creates an acoustically reflective air gap between the cover and the processing surface. Ultrasonic waves scanned across the component reflect from this gap, creating an image of the internal structure of the component.
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Inventors:
Mallard, Richard Elle.
Application Number:
JP50974495A
Publication Date:
November 19, 2001
Filing Date:
July 11, 1994
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G01N29/22; G01N29/265; G01N29/04; (IPC1-7): G01N29/10; G01N29/04
Domestic Patent References:
| JP4127052A |
Attorney, Agent or Firm:
Akira Asamura (3 outside)