Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3349413
Kind Code:
B2
Inventors:
Osamu Nishio
Application Number:
JP29424997A
Publication Date:
November 25, 2002
Filing Date:
October 27, 1997
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/28; H01L21/336; H01L21/8234; H01L27/088; H01L29/78; (IPC1-7): H01L29/78; H01L21/28; H01L21/336; H01L21/8234; H01L27/088
Domestic Patent References:
| JP2273971A | ||||
| JP5160399A | ||||
| JP9139382A |
Attorney, Agent or Firm:
Takaya Koike