Title:
金属成形方法
Document Type and Number:
Japanese Patent JP3711408
Kind Code:
B2
Abstract:
Atomized metal is deposited metal onto a substrate so as to cause at least partial solidification of the deposited metal; further atomized metal is deposited onto the partially solidified deposited metal on the substrate; and the metal deposited onto the partially solidified deposited metal is allowed to fully solidify on the substrate; the cooling of the further deposited metal, and the composition of the metal and/or of a gas used in the atomization of the further atomized metal being tailored such that volumetric contraction on solidification and cooling of the further deposited metal is compensated for, when the deposited metal has been cooled to ambient temperature, by volumetric expansion in a reaction or phase change in the further deposited metal.
Inventors:
Roach, Allen Dennis
Richard Michael, Jordan
Richard Michael, Jordan
Application Number:
JP51071096A
Publication Date:
November 02, 2005
Filing Date:
September 25, 1995
Export Citation:
Assignee:
Spray Foam Holdings Limited
International Classes:
C23C4/02; C23C4/12; C23C4/18; (IPC1-7): C23C4/12; C23C4/18
Domestic Patent References:
| JP56169766A | ||||
| JP56102574A | ||||
| JP58052451A | ||||
| JP57071671A | ||||
| JP6010112A |
Attorney, Agent or Firm:
Akihiko Umeda