銅微粒子焼結体型の微細形状導電体の形成方法、該方法を応用した銅微細配線ならびに銅薄膜の形成方法

Japanese Patent JP3939735

B2

The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, conducting a treatment for reducing the copper fine particles with the surface oxide film layer or copper oxide fine particles included in the pattern at a comparatively low temperature, and baking the resultant copper fine particles. Specifically, the process carries out the processes of; applying a dispersion containing the copper fine particles having the surface oxide film layer thereon or the copper oxide fine particles with an average particle diameter of 10 µm or smaller onto a substrate; and then performing a series of the heat treatment steps of heating the particles in the coated layer at temperature of 350°C or lower under an atmosphere containing a vapor and a gas of a compound having reducibility to reduce the oxide film by a reduction reaction which used the compound having reducibility as a reducing agent, subsequently repeating a heat treatment combining an oxidizing treatment of a short time with a re-reducing treatment, and sintering the resultant copper fine particles with each other to form a layer of the sintered product.

Daisuke Ito
Akihito Izumiya
Noriaki Hata
Matsudaira Yorishige

JP2005504486A

July 04, 2007

May 13, 2004

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Harima Chemicals Co., Ltd.

H05K3/12; H05K3/10; H05K3/20

JP6224538A
JP2002324966A
JP115961A
JP11267879A
JP2002271005A
JP457389A

Akio Miyazaki
Katsuhiro Ito
Ishibashi Masayuki

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