Title:
回路形成基板の製造方法および回路形成基板の製造用材料
Document Type and Number:
Japanese Patent JP3979391
Kind Code:
B2
Abstract:
A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.
Inventors:
Toshihiro Nishii
Application Number:
JP2004016795A
Publication Date:
September 19, 2007
Filing Date:
January 26, 2004
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K3/46; H05K3/40; H05K3/38
Domestic Patent References:
| JP11251703A | ||||
| JP9214137A | ||||
| JP8001859A |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano