Title:
易引裂性包装用積層材料、その製造方法およびそれを用いた包装袋
Document Type and Number:
Japanese Patent JP3995860
Kind Code:
B2
More Like This:
Inventors:
Kim Kipyeong
Katsunori Futase
Katsunori Futase
Application Number:
JP2000083592A
Publication Date:
October 24, 2007
Filing Date:
March 24, 2000
Export Citation:
Assignee:
Taisei Lamick Co., Ltd.
International Classes:
B32B27/00; B65D30/02; B29C65/52; B65D33/00; B65D65/30; B65D65/40; B65D65/42
Domestic Patent References:
| JP6055714A | ||||
| JP8080977A | ||||
| JP10029263A | ||||
| JP5042951A |
Attorney, Agent or Firm:
Junzo Ogawa
Morio Nakamura
Morio Nakamura