Title:
電子部品の製造方法
Document Type and Number:
Japanese Patent JP4247880
Kind Code:
B2
Abstract:
Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical connection between the wiring patterns through an interlayer connecting portion penetrating the insulating layer. In the method, a first step of forming a wiring pattern and a columnar conductor and a second step of forming a layer having a uniform thickness by bonding an insulating sheet from above and pressing the insulating sheet to the height of the columnar conductor with the columnar conductor as a stopper so as to conform the thickness of the insulating sheet to the height of the columnar conductor are repeated.
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Inventors:
Masashi Goto
Kawasaki Kaoru
Mutsuko Nakano
Hiroshi Yamamoto
Kawasaki Kaoru
Mutsuko Nakano
Hiroshi Yamamoto
Application Number:
JP2002371672A
Publication Date:
April 02, 2009
Filing Date:
December 24, 2002
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01L23/12; H05K3/46
Domestic Patent References:
| JP2001217339A | ||||
| JP61181662A | ||||
| JP11074636A | ||||
| JP8125331A | ||||
| JP2001274554A |
Attorney, Agent or Firm:
Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa