Title:
難燃性エポキシ樹脂組成物およびそれを用いた半導体封止材料並びに半導体装置
Document Type and Number:
Japanese Patent JP4273801
Kind Code:
B2
Inventors:
Hirose Hiroshi
Fukase Toshimitsu
Fukase Toshimitsu
Application Number:
JP2003083735A
Publication Date:
June 03, 2009
Filing Date:
March 25, 2003
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/62; C08K3/00; C08K5/01; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP11140166A | ||||
| JP2003064157A | ||||
| JP2003012772A | ||||
| JP2003026778A | ||||
| JP2002363381A | ||||
| JP2002363261A | ||||
| JP64085215A |