To easily form an auxiliary electrode.
A lower electrode layer 3, a piezoelectric layer 4 and an upper electrode layer 5 are sequentially laminated/formed on a surface of a substrate 1. A first resist film is formed on the upper electrode layer 5, and an outer periphery of the first resist film is etched by dry etching to a lower part of the piezoelectric layer 4. The first resist film is peeled, a second resist film 8 covering the upper electrode layer 5 and the piezoelectric layer 4 except for a part of the piezoelectric layer 4 is formed, and an opening part 15 is formed. The piezoelectric layer 4 of the opening part 15 is removed by wet etching, and a part of the lower electrode layer 3 being a lower layer is exposed. The auxiliary electrode 6 is formed on the exposed lower electrode layer 3, and the second resist film 8 is peeled.
COPYRIGHT: (C)2004,JPO
Koji Nomura
Hiroki Naito
Daisuke Nagano
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