Title:
微細配線の作製方法並びに該微細配線を備えた電子部品
Document Type and Number:
Japanese Patent JP4324668
Kind Code:
B2
Inventors:
Takashi Kinoshita
Toshihiko Niwa
Kenji Sumiyama
Yamamuro Sasu
Toshihiko Niwa
Kenji Sumiyama
Yamamuro Sasu
Application Number:
JP2004005665A
Publication Date:
September 02, 2009
Filing Date:
January 13, 2004
Export Citation:
Assignee:
National Institute of Technology Nagoya Institute of Technology
International Classes:
H05K3/14; H05K3/38
Domestic Patent References:
| JP2002284900A | ||||
| JP62163205A | ||||
| JP4145664A | ||||
| JP3182011A | ||||
| JP3034211A | ||||
| JP2003324036A |
Attorney, Agent or Firm:
Makoto Abe
Teshima Masaru
Michiko Oi
Teshima Masaru
Michiko Oi
Previous Patent: JPS4324667
Next Patent: SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND DATA PROCESSING SYSTEM USING SAME
Next Patent: SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND DATA PROCESSING SYSTEM USING SAME