Title:
電子パッケージおよび熱放散方法
Document Type and Number:
Japanese Patent JP4346972
Kind Code:
B2
Abstract:
An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.
Inventors:
David J. Alcoe
William El Brodsky
Valaprasad Buoy Karmidi
Sanjeev Be Sus
Randall Jay Statsman
William El Brodsky
Valaprasad Buoy Karmidi
Sanjeev Be Sus
Randall Jay Statsman
Application Number:
JP2003181880A
Publication Date:
October 21, 2009
Filing Date:
June 25, 2003
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
H01L23/473; H05K7/20; H01L23/10; H01L23/36; H01L23/40; H01L23/42; H01L23/427
Domestic Patent References:
| JP57206055A | ||||
| JP10288481A | ||||
| JP36848A | ||||
| JP5235572A | ||||
| JP200177257A | ||||
| JP2002100713A |
Attorney, Agent or Firm:
Takeshi Ueno
Yoshihiro City
Hiroshi Sakaguchi
Yoshihiro City
Hiroshi Sakaguchi
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