Title:
枚葉式ウエハ洗浄システムにおける電解腐食の影響を抑制するための装置および方法
Document Type and Number:
Japanese Patent JP4638145
Kind Code:
B2
Abstract:
A single substrate cleaning apparatus that prevents galvanic corrosion is provided. The apparatus includes a spindle configured to rotatably support a substrate. A moveable dispense arm disposed over the spindle is included. The dispense arm supports a first supply line and a second supply line. The first supply line has a first nozzle affixed to an end of the first supply line, and the second supply line has a second nozzle affixed to an end of the second supply line. The first nozzle is positioned behind the second nozzle such that a fluid dispensed from the second nozzle is dried by application of a fluid simultaneously dispensed from the first nozzle in manner that protects the substrate from galvanic corrosion.
Inventors:
Boyd John M.
Lovekin Mike
Mikairich Katrina A.
Lovekin Mike
Mikairich Katrina A.
Application Number:
JP2003513018A
Publication Date:
February 23, 2011
Filing Date:
July 11, 2002
Export Citation:
Assignee:
LAM RESEARCH CORPORATION
International Classes:
H01L21/304; H01L21/00; H01L21/02; H01L21/311; H01L21/321; H01L21/306
Domestic Patent References:
| JP5315331A | ||||
| JP11233481A | ||||
| JP200170861A | ||||
| JP20017071A | ||||
| JP5175183A | ||||
| JP1140526A | ||||
| JP6266119A |
Attorney, Agent or Firm:
Meisei International Patent Office