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Title:
半導体装置の製造方法と物品の製造方法
Document Type and Number:
Japanese Patent JP4684984
Kind Code:
B2
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Inventors:
Terasaki Atsunori
Junichi Seki
Ichiro Tanaka
Application Number:
JP2006303960A
Publication Date:
May 18, 2011
Filing Date:
November 09, 2006
Export Citation:
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Assignee:
Canon Inc
International Classes:
H01L21/768; H01L21/3065
Domestic Patent References:
JP2009523312A
JP11330235A
JP2003100753A
Foreign References:
WO2005031855A1
Other References:
Michael D. Stewart, et al.,Direct Imprinting of Dielectric Materials for Dual Damascene Processing,Proceedings of SPIE,2005年 5月13日,Vol.5751,pp.210-218
Attorney, Agent or Firm:
Takuma Abe
Sogo Kuroiwa



 
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