Title:
エンボスキャリアテープおよびその製造方法
Document Type and Number:
Japanese Patent JP4754356
Kind Code:
B2
Abstract:
To provide an embossed carrier tape with highly rectangular recesses, and its manufacturing process.
A marginal section and a thin-walled section 13 are formed on a substrate 4 by the following steps. The substrate 4 is placed between a die plate 2 and a stripper plate 3 and held tight. A shaping punch 1 is lowered in the direction of the die plate 2, and a part of the substrate 4 is stretched to form a plurality of recesses 12. Then, the shaping punch 1 is further lowered and the substrate 4 is made thin-walled in sections among the recesses 12 by compression between the die plate 2 and a substrate compressing zone 1b.
COPYRIGHT: (C)2007,JPO&INPIT
Inventors:
Takashi Yamaguchi
Application Number:
JP2006003520A
Publication Date:
August 24, 2011
Filing Date:
January 11, 2006
Export Citation:
Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
B29C43/02; B65B15/04; B65D73/02; B29L31/00
Domestic Patent References:
| JP2219763A | ||||
| JP5201479A | ||||
| JP2000185766A | ||||
| JP62220459A | ||||
| JP63295234A |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama