Title:
印刷回路基板及びこれを利用した表示装置
Document Type and Number:
Japanese Patent JP5014602
Kind Code:
B2
Abstract:
A printed circuit board on which a connector is mounted includes a conductive layer, insulating layers, and a supporting member. A part of the conductive layer is exposed on a top surface of the PCB in order to form a connecting pad portion for connecting the connector. The insulating layers are disposed proximate to both sides of the conductive layer. The supporting member is connected to the conductive layer and covers a surface of a hole formed by opening an orifice through the conductive layer and the insulating layer. The hole is disposed adjacent to the connecting pad portion.
Inventors:
Sung Kim
Park Park
Park Park
Application Number:
JP2005211574A
Publication Date:
August 29, 2012
Filing Date:
July 21, 2005
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
H05K1/02; H05K1/11; H05K1/18; H05K3/46
Domestic Patent References:
| JP6120658A | ||||
| JP11040293A | ||||
| JP7321434A | ||||
| JP2003197676A | ||||
| JP2003198113A | ||||
| JP10022635A | ||||
| JP2237142A | ||||
| JP846311A | ||||
| JP6338670A | ||||
| JP2002141667A |
Attorney, Agent or Firm:
Mikio Hatta
Yasuo Nara
Katsuyuki Utani
Yasuo Nara
Katsuyuki Utani