Title:
水性アルカリフォトレジスト洗浄組成物及び該組成物を使用する方法
Document Type and Number:
Japanese Patent JP5015553
Kind Code:
B2
Abstract:
The invention relates to an aqueous alkaline photoresist cleaning composition, comprising, based on the total weight of the composition, 1 to 50 wt% of at least one alkaline compound; 0.1 to 20 wt% of at least one diamine compound; and 30 to 98.9 wt% of water, wherein the composition has a pH of above 12. Before being used, the photoresist cleaning composition of the present invention can be heated and/or diluted to meet the actual process requirements. Furthermore, since the composition of the present invention is free of organic solvents, it can be safely utilized under common operation environments.
Inventors:
Tsai, Wan Han
Ryu, Wen Chen
Chen, Chiang Ching
Ryu, Wen Chen
Chen, Chiang Ching
Application Number:
JP2006303565A
Publication Date:
August 29, 2012
Filing Date:
November 09, 2006
Export Citation:
Assignee:
Epoch Material CEO, LDT.
International Classes:
G03F7/42; C11D3/04; C11D3/26; C11D3/30; C11D7/06; C11D7/32; G02B5/20
Domestic Patent References:
| JP11251214A | ||||
| JP11311867A |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Masaharu Konoue
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Masaharu Konoue