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Title:
給湯システム
Document Type and Number:
Japanese Patent JP5029039
Kind Code:
B2
Abstract:

To provide a hot water supply system advantageous in reduction of a hot water storage space, and improvement of energy efficiency.

The hot water supply system has a heat pump 20 carrying a first medium, a heat storage unit 50 thermally connected to the heat pump 20 and storing heat from the heat pump 20, and a supply unit 30 carrying a second medium. The heat pump 20 has a compressing part 22 compressing the first medium in multiple stages. In the supply unit 30, the second medium is heated by heat from at least one of the heat storage unit 50 or the heat pump 20.

COPYRIGHT: (C)2008,JPO&INPIT


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Inventors:
Shuichi Umezawa
Application Number:
JP2007019586A
Publication Date:
September 19, 2012
Filing Date:
January 30, 2007
Export Citation:
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Assignee:
THE TOKYO ELECTRIC POWER COMPANY,INCORPORATED
International Classes:
F24H1/00; F24H1/18; F25B1/00; F25B1/10; F28D20/00
Domestic Patent References:
JP2004239507A
JP2005164124A
JP2002106988A
JP2006084090A
JP2005241092A
JP2005030758A
JP2006292365A
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe