Title:
半導体チップ検査用ソケット
Document Type and Number:
Japanese Patent JP5119360
Kind Code:
B2
Abstract:
The present invention relates to a socket for testing a semiconductor chip. In order to improve durability and ease of manufacture, the disclosed socket comprises: a flat supporting plate which has a through-hole formed in the center thereof, a silicon portion which is coupled with the through-hole and has protrusions, a plurality of conductive silicon portions which are formed by vertically arranging metal balls on the protrusions, a plurality of plungers which are configured at the upper part of the conductive silicon portions and are contacted with solder balls of the semiconductor chip, and a cap which has through-holes formed at positions corresponding to the plungers. An acceptor formed at the lower part of the cap accommodates the protrusions, and the cap couples the plungers with the silicon portion. Since the plungers having projected probes contacted with the solder balls of the semiconductor chip are coupled with the upper part of the conductive silicon portions, abrasion of the conductive silicon portions can be prevented. Also, durability of the socket is improved. In addition, due to a simple structure allowing the acceptor to connect the silicon portion and the cap using adhesives, the socket can easily manufactured.
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Inventors:
Lee Aya
Application Number:
JP2011501714A
Publication Date:
January 16, 2013
Filing Date:
March 12, 2009
Export Citation:
Assignee:
LEENO INDUSTRIAL INC.
International Classes:
G01R1/067; H01R33/76; G01R31/26; H01L21/66; H01R11/01
Domestic Patent References:
| JP2001307851A | ||||
| JP2005050782A | ||||
| JP2001084841A | ||||
| JP2001091579A | ||||
| JP2003092317A |
Attorney, Agent or Firm:
Takuya Ohara
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