Title:
チップの製造のための方法
Document Type and Number:
Japanese Patent JP5119361
Kind Code:
B2
Abstract:
A method for manufacturing chips (1, 2), in which at least one diaphragm (11, 12) is produced in the surface layer of a semiconductor substrate (10) spanning a cavity (13). The functionality of the chip (1, 2) is then integrated into the diaphragm (11, 12). In order to separate the chip (1, 2), the diaphragm (11, 12) is detached from the substrate composite. The method according to the present invention is characterized by metal plating of the back of the chip (1, 2) in an electroplating process before the chip is separated.
Inventors:
Torsten Clammer
Matthias Boehringer
Stephan pinter
Hubert Benzel
Matthias Illing
Frieder Hark
Gimon alum bulster
Matthias Boehringer
Stephan pinter
Hubert Benzel
Matthias Illing
Frieder Hark
Gimon alum bulster
Application Number:
JP2011508802A
Publication Date:
January 16, 2013
Filing Date:
December 02, 2008
Export Citation:
Assignee:
ROBERT BOSCH GMBH
International Classes:
B81C1/00; H01L29/84
Domestic Patent References:
| JP2005528779A | ||||
| JP2009529795A |
Attorney, Agent or Firm:
Takuya Kuno
Toshio Yano
Takahashi
Kimihiro Hoshi
Hiroyasu Ninomiya
Ryoichi Shino
Einzel Felix-Reinhard
Toshio Yano
Takahashi
Kimihiro Hoshi
Hiroyasu Ninomiya
Ryoichi Shino
Einzel Felix-Reinhard