Title:
発光ダイオード装置
Document Type and Number:
Japanese Patent JP5166871
Kind Code:
B2
Abstract:
The assembly has a light-emitting chip (1) with a radiation decoupling surface (2), via which the greater part of the electromagnetic radiation that is generated in the chip emerges in a primary emission direction. The chip is placed on a heat sink (4). A housing (5) laterally surrounds the chip and a reflective lens (6) is situated downstream of the surface (2) in the primary emission direction. An independent claim is also included for a utilization of the light emitting assembly in equipment such as camera mobile phone, digital camera or video camera.
Inventors:
Georg Borgner
Stephan Grecchu
Gunter Weiter
Mario vaninger
Stephan Grecchu
Gunter Weiter
Mario vaninger
Application Number:
JP2007519604A
Publication Date:
March 21, 2013
Filing Date:
May 18, 2005
Export Citation:
Assignee:
Osram Opto Semiconductors GmbH
International Classes:
H01L33/60; H01L33/62; H01L33/64; H01L33/58
Domestic Patent References:
| JP2004056109A | ||||
| JP2002299698A | ||||
| JP3091911U | ||||
| JP2005197633A | ||||
| JP2004327955A |
Foreign References:
| WO2004053933A1 |
Attorney, Agent or Firm:
Toshio Yano
Takuya Kuno
Einzel Felix-Reinhard
Takuya Kuno
Einzel Felix-Reinhard