一括リフローで実装された画像センサ

Title:

一括リフローで実装された画像センサ

Document Type and Number:

Japanese Patent JP5201770

Kind Code:

B2

Abstract:

An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.

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Inventors:

Sengapta, Cable Es
Asadi, aza
Alley, Alan Bee
Robert Shii, Sandal

Application Number:

JP2000576612A

Publication Date:

June 05, 2013

Filing Date:

October 11, 1999

Export Citation:

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Assignee:

INTEL CORPORATION

International Classes:

G02B5/20; H01L27/14; H01L27/146; H01L31/0203; H05K3/34

Domestic Patent References:

JP6333622A
JP7106351A
JP1167808A
JP1152449A
JP63258027A
JP8139298A
JP8146210A
JP10170714A

Attorney, Agent or Firm:

Masaki Yamakawa
Shigeki Yamakawa
Hiroro Kurokawa

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