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Title:
熱伝導性LED組立体
Document Type and Number:
Japanese Patent JP5357034
Kind Code:
B2
Abstract:
A thermally conductive LED assembly is disclosed. The thermally conductive LED assembly includes an elongate conductor cable having a first conductor and a second conductor extending along a length of the elongate conductor cable and a thermally conducting and electrically insulating polymer layer disposed between first conductor and second conductor and a second electrically insulating polymer layer is disposed on the first conductor or second conductor. The electrically insulating polymer layer having a thermal impedance value in a range from 2.5 to 15 C°-cm2/W and a plurality of light emitting diodes are disposed along the length of the elongate conductor cable. Each light emitting diode is in electrical communication with the first conductor and the second conductor.

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Inventors:
Mays, Michael A.
Colpera, Susan El.
Jansen, Jeffrey Earl.
Hager, Patrick Jay.
Ehling, Ellen Oh.
Application Number:
JP2009529311A
Publication Date:
December 04, 2013
Filing Date:
September 14, 2007
Export Citation:
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Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
H01L33/48; H01L33/64
Domestic Patent References:
JP2001291807A
JP2005311314A
JP10286911A
JP2004006724A
JP2006135288A
JP2003124528A
JP2001284504A
JP2006100397A
Foreign References:
WO2006070457A1
WO2006052330A1
WO2005062382A1
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Atsushi Ebiya
Masatoshi Takahashi