Title:
PATTERNED LAYER COMPOSITE MATERIAL
Document Type and Number:
Japanese Patent JP2018050031
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a microchip arranged on a substrate by improving a known package for a microchip.SOLUTION: A method includes the steps of: providing a layer composite material including a substrate 11 having an adhesive layer 13 applied at least partially thereon; introducing an opening 41 in the substrate 11 and the adhesive layer 13, the opening penetrating therethrough, in order to obtain a patterned layer composite material; providing a microchip having an active portion 16 arranged on the outside of the microchip, the active potion 16 being a sensor area or a radiation coupling-out area; and arranging the microchip on the adhesive layer 13 of the patterned layer composite material such that the active portion 16 is exposed through the opening 41.SELECTED DRAWING: Figure 1E
Inventors:
CHRISTOF LANDESBERGER
DIETER BOLLMANN
WALTRAUD HELL
GERHARD KLINK
DIETER BOLLMANN
WALTRAUD HELL
GERHARD KLINK
Application Number:
JP2017142490A
Publication Date:
March 29, 2018
Filing Date:
July 24, 2017
Export Citation:
Assignee:
FRAUNHOFER GES ZUR FOERDERUNG DER ANGEWANDTE FORSCHUNG E V
International Classes:
H01L21/60; B81B7/02; B81C3/00; G01L9/00; H01L23/12; H01L31/02; H01L33/48
Domestic Patent References:
| JP2001189345A | 2001-07-10 | |||
| JP2001267372A | 2001-09-28 | |||
| JP2013187491A | 2013-09-19 | |||
| JP2001051191A | 2001-02-23 | |||
| JPH11163045A | 1999-06-18 | |||
| JP2007158184A | 2007-06-21 |
Attorney, Agent or Firm:
Daisuke Noguchi