Title:
半導体装置及びその製造方法、並びに電子装置
Document Type and Number:
Japanese Patent JP5372579
Kind Code:
B2
Abstract:
A disclosed semiconductor device includes a reinforcing board having first and second faces, an electronic part accommodating portion penetrating the reinforcing board, a through hole, an electronic part having a front face on which an electrode pad is formed and a back face, a through electrode installed inside the through hole, a first sealing resin filling a gap between the through electrode and an inner wall of the through hole, a second sealing resin filled into the electronic part accommodating portion while causing the bonding face of the electrode pad of the electronic part accommodating portion to be exposed to an outside, and a multi-layered wiring structure configured to include insulating layers laminated on the first face of the reinforcing board and an interconnection pattern, wherein the interconnection pattern is directly connected to the electrode pad of the electronic part and the through electrode.
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Inventors:
Kenta Uchiyama
Akihiko Tateiwa
Akihiko Tateiwa
Application Number:
JP2009096024A
Publication Date:
December 18, 2013
Filing Date:
April 10, 2009
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H01L25/11; H01L25/10; H01L25/18
Domestic Patent References:
| JP2008263220A | ||||
| JP2004530285A | ||||
| JP2007129148A | ||||
| JP2001274034A | ||||
| JP2008078596A | ||||
| JP61502294A |
Attorney, Agent or Firm:
Tadahiko Ito