Title:
接着フィルム、接着シート、半導体装置及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5374971
Kind Code:
B2
Abstract:
To provide: an adhesive film and an adhesive sheet which can be stuck on a member such as a semiconductor wafer and can be easily peeled off from a member such as a dicing sheet; and a semiconductor device and a method for manufacturing the semiconductor device using the same.
The adhesive film 1 comprises a high tuck face A and a low tuck face B. When the tuck strength of the high tuck face A at 40°C is FA and the tuck strength of the low tuck face B at 40°C is FB, a relation of FA-FB≥10 gf and FA≥10 gf is satisfied. The high tuck face A contains a first adhesive resin composition and the low tuck face B contains a second adhesive resin composition different from the first adhesive resin composition.
COPYRIGHT: (C)2010,JPO&INPIT
Inventors:
Takashi Masuko
Keiichi Hatakeyama
Yoshinobu Ozaki
Nakamura Yuki
Masanobu Miyahara
Keiichi Hatakeyama
Yoshinobu Ozaki
Nakamura Yuki
Masanobu Miyahara
Application Number:
JP2008223867A
Publication Date:
December 25, 2013
Filing Date:
September 01, 2008
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/52; C09J7/02; H01L21/301
Domestic Patent References:
| JP2004247657A | ||||
| JP2005260204A | ||||
| JP2007270125A | ||||
| JP2004165687A | ||||
| JP2004266137A | ||||
| JP6172716A | ||||
| JP2008056820A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Tosuke Yosuke
Yoshinori Shimizu
Tosuke Yosuke