To provide an adhesive film and an adhesive sheet which can be adhered, for example, to a member such as a semiconductor wafer at low temperature, easily peeled off, for example, from a member such as a dicing sheet, and air bubbles are hard to be generated between the adhesive film and a support member, for example, when the adhesive film is adhered to the support member, to provide a semiconductor device using the same, and to provide a method for manufacturing the semiconductor device.
The adhesive film has a high tack side A and a low tack side B. When tack strength of the high tack side A at 40°C is denoted by FA, and tack strength of the low tack side B at 40°C is denoted by FB, relations of FA/FB≥5 and FA≥10gf are satisfied. The high tack side A contains a first adhesive resin compound, and the low tack side B contains a second adhesive resin compound different from the first adhesive resin compound. Storage elasticity of a hardened material of the second adhesive resin compound at 260°C is 0.1-2.0 MPa.
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