Title:
ハニカムセグメント接合体
Document Type and Number:
Japanese Patent JP5600245
Kind Code:
B2
Abstract:
There is disclosed a bonded honeycomb segment assembly which is excellent in thermal shock resistance. The bonded honeycomb segment assembly has a plurality of honeycomb segments 2 each including a cell structure having a plurality of cells 5 as fluid passages partitioned by porous partition walls 6 and provided in parallel with one another, and an outer wall provided in the outer periphery of the cell structure. The outer wall of each of the plurality of honeycomb segments 2 is bonded to one another via bonding layers 9. A relation of M 1 < M 2 is satisfied in which M 1 is a compressive Young's modulus in the thickness direction of the bonding layers positioned in the vicinity of a gravity point in a cross section of the bonded honeycomb segment assembly perpendicular to the fluid passage direction of the cells, and M 2 is a compressive Young's modulus in the thickness direction of the bonding layers bonding the outer wall of each of the plurality of honeycomb segments positioned in the outermost periphery of the bonded honeycomb segment assembly.
Inventors:
Tomoyoshi Takagi
Reiji Matsubara
Reiji Matsubara
Application Number:
JP2009082561A
Publication Date:
October 01, 2014
Filing Date:
March 30, 2009
Export Citation:
Assignee:
NGK Insulators, Ltd.
International Classes:
C04B37/00; B01D39/20; F01N3/022
Attorney, Agent or Firm:
Ippei Watanabe