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Patent Searching and Data


Title:
電子ペーパーおよびその製造方法
Document Type and Number:
Japanese Patent JP5647987
Kind Code:
B2
Abstract:
Electronic paper 100 according to the present invention includes a first substrate 10 with first electrodes 14, a second substrate 20 with second electrodes 24, and a powder sheet structure 50 arranged between the first substrate 10 and the second substrate 20. The powder sheet structure 50 includes a bottom substrate 52 and a top substrate 54 opposed to each other, a dividing wall layer 56 including dividing walls 55 arranged between the bottom substrate 52 and the top substrate 54, and powder particles 30 enclosed between the adjacent dividing walls 55 in the dividing wall layer 56. The powder sheet structure is arranged so that the bottom substrate is opposed to the first electrodes of the first substrate, and that the top substrate is opposed to the second electrodes of the second substrate.

Inventors:
中川 昌己
豊田 昭則
Application Number:
JP2011534966A
Publication Date:
January 07, 2015
Filing Date:
January 25, 2011
Export Citation:
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Assignee:
パナソニックIPマネジメント株式会社
International Classes:
G02F1/1675
Domestic Patent References:
JPH11277951A1999-10-12
JP2005017906A2005-01-20
JPH0313984A1991-01-22
JPH08122769A1996-05-17
JPH08338972A1996-12-24
JP2002139748A2002-05-17
JPH11277951A1999-10-12
Attorney, Agent or Firm:
Mitsuo Tanaka
Mutsumi Sameshima
Okabe Hiroshi
Kazuhisa Inaba