Title:
半導体デバイスの駆動方法
Document Type and Number:
Japanese Patent JP5701015
Kind Code:
B2
Abstract:
Provided is a semiconductor device, including an electrode, a first insulator, a first semiconductor having a bandgap of 2 eV or greater, a second insulator, and a second semiconductor, which are stacked on one another, and at least further including one or more electrodes in contact with the first semiconductor and two or more electrodes in contact with the second semiconductor.
Inventors:
Abe Katsumi
Kumi Hideya
Akira Hayashi
Tatsuya Iwasaki
Kumi Hideya
Akira Hayashi
Tatsuya Iwasaki
Application Number:
JP2010249443A
Publication Date:
April 15, 2015
Filing Date:
November 08, 2010
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L29/786; H01L21/336; H01L21/8234; H01L27/088; H01L29/78
Domestic Patent References:
| JP9097906A | ||||
| JP5006997A | ||||
| JP2010251721A | ||||
| JP2011049537A |
Foreign References:
| US5998842 | ||||
| US20100244021 |
Attorney, Agent or Firm:
Keisuke Watanabe
Yoshihiro Yamaguchi
Yoshihiro Yamaguchi