Title:
吐出素子基板の製造方法
Document Type and Number:
Japanese Patent JP5701014
Kind Code:
B2
Abstract:
A method for manufacturing an ejection element substrate, which is provided with a flow-channel-forming member having an ejection orifice for ejecting a liquid and a liquid flow channel that is communicated with the ejection orifice, a substrate having a supply port for supplying the liquid to the liquid flow channel, and a filter structure formed in the bottom of the supply port, includes: forming the supply port by forming a through-hole by etching the substrate from a second face of the substrate on the side opposite to a first face of the substrate, on which the flow-channel-forming member is disposed; providing a resinous protection film on the side face and the bottom of the supply port; and forming a minute opening in the resinous protection film in the bottom of the supply port by carrying out a laser processing from the side of the second face.
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Inventors:
Sota Takeuchi
Hirokazu Komuro
Sakuma Sadayoshi
Hirokazu Komuro
Sakuma Sadayoshi
Application Number:
JP2010248886A
Publication Date:
April 15, 2015
Filing Date:
November 05, 2010
Export Citation:
Assignee:
Canon Inc
International Classes:
B41J2/16; B41J2/14
Domestic Patent References:
| JP2009202401A | ||||
| JP2008179045A | ||||
| JP11129482A | ||||
| JP10006514A | ||||
| JP2010512261A | ||||
| JP2005144850A | ||||
| JP2010005795A | ||||
| JP2005178364A |
Attorney, Agent or Firm:
Akio Miyazaki
Masaaki Ogata
Masaaki Ogata