Title:
化学的に類似している基材の仮接着
Document Type and Number:
Japanese Patent JP5774219
Kind Code:
B2
Abstract:
A temporary adhesive for reversibly bonding a silicon wafer to a silicon support contains a crosslinkable organopolysiloxanes composition and a fatty acid or salt thereof or fatty acid ester as a release regulator having a density different from the crosslinkable organopolysiloxanes composition of at least 0.1 g/cm3, which upon parting of the wafer from the substrate, the adhesive remains substantially adhered to the substrate.
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Inventors:
Kellenberger, Andreas
Frank Achenbach
Frank Achenbach
Application Number:
JP2014520611A
Publication Date:
September 09, 2015
Filing Date:
July 11, 2012
Export Citation:
Assignee:
Wacker Chemie AG
International Classes:
H01L21/60; C09J5/00; C09J11/06; C09J183/00; H01L21/683
Domestic Patent References:
| JP2011119427A | ||||
| JP2000026812A |
Attorney, Agent or Firm:
Kawaguchi International Patent Office