Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
エッチング方法、およびこれに用いられるエッチング液
Document Type and Number:
Japanese Patent JP5798939
Kind Code:
B2
Abstract:
An etching method having the step of: applying an etching liquid to a substrate, the etching liquid containing: a fluorine ion, a nitrogen-containing compound having at least 2 of nitrogen-containing structural units, and water, the etching liquid having a pH of being adjusted to 5 or less; and etching a titanium compound in the substrate.

More Like This:
JPS5928036[Title of the device] Chemical etching processing unit
JP2007305832MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
JP2008004931METHOD OF MANUFACTURING FRONT FACE EMISSION TYPE NITRIDE LIGHT-EMITTING ELEMENT
Inventors:
Atsushi Mizutani
Tokomitsu Tomeba
Kazutaka Takahashi
Tadashi Inaba
Application Number:
JP2012013310A
Publication Date:
October 21, 2015
Filing Date:
January 25, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIFILM Corporation
International Classes:
H01L21/306; C23F1/26; H05K3/06
Domestic Patent References:
JP2008547202A
JP2011228618A
Foreign References:
WO2006137497A1
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae



 
Previous Patent: 画像形成装置

Next Patent: JPS5798940