Title:
ハロ炭化水素ポリマーコーティング
Document Type and Number:
Japanese Patent JP5813850
Kind Code:
B2
Abstract:
In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
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Inventors:
Humphreys, Mark, Robson
Ferdinandi, Frank
Smith, rodney, edward
Ferdinandi, Frank
Smith, rodney, edward
Application Number:
JP2014224131A
Publication Date:
November 17, 2015
Filing Date:
November 04, 2014
Export Citation:
Assignee:
Sembrant Limited
International Classes:
H05K3/28; B32B15/08
Domestic Patent References:
| JP6232098A | ||||
| JP2001257437A |
Foreign References:
| US20040026775 |
Attorney, Agent or Firm:
Yusuke Hiraki
Satoshi Fujita
Eiichi Arai
Natsuo Tanaka
Satoshi Fujita
Eiichi Arai
Natsuo Tanaka