Title:
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2004327703
Kind Code:
A
Abstract:
To provide a circuit board wherein oxidation of a conductive pattern is prevented, and to provide a method of manufacturing the circuit board.
This circuit board 1 is provided with a film-like base material 3, the conductive pattern 4 formed on the base material 3, and a resin layer 2 formed of photoresist on the conductive pattern. The photoresist is resin containing a photopolymerization initiator, photopolymerizable acrylicmonomer or acrylic oligomer as main components. The line width of the conductive pattern is not wider than 20μm.
Inventors:
KAWAHARA YUSUKE
SHIOIRI KAZUNORI
YOSHIDA TETSUYA
ICHIKAWA KAZUYOSHI
SHIOIRI KAZUNORI
YOSHIDA TETSUYA
ICHIKAWA KAZUYOSHI
Application Number:
JP2003120113A
Publication Date:
November 18, 2004
Filing Date:
April 24, 2003
Export Citation:
Assignee:
KONICA MINOLTA HOLDINGS INC
International Classes:
H05K3/28; H05K3/10; (IPC1-7): H05K3/28; H05K3/10
Attorney, Agent or Firm:
Hiroshi Arafune