Title:
パターン形成方法
Document Type and Number:
Japanese Patent JP5856550
Kind Code:
B2
Abstract:
According to one embodiment, a pattern forming method includes forming a physical guide including a first predetermined pattern in a first region on a to-be-processed film, and a second predetermined pattern in a second region on the to-be-processed film, forming a block copolymer in the physical guide, forming a self-assembled phase including a first polymer portion and a second polymer portion by causing microphase separation of the block copolymer, removing the second polymer portion, and processing the to-be-processed film, with the physical guide and the first polymer portion serving as a mask. A pattern height of the first predetermined pattern is greater than a pattern height of the second predetermined pattern.
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Inventors:
Hitoshi Kubota
Minoru Kobayashi
Yusuke Sekiguchi
Minoru Kobayashi
Yusuke Sekiguchi
Application Number:
JP2012182454A
Publication Date:
February 09, 2016
Filing Date:
August 21, 2012
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L21/027; G03F7/40
Domestic Patent References:
| JP2012134353A | ||||
| JP2010023360A | ||||
| JP2011071448A |
Foreign References:
| WO2009037921A1 | ||||
| WO2012106121A2 |
Attorney, Agent or Firm:
Hirohito Katsunuma
Yasukazu Sato
Yasushi Kawasaki
Takeshi Sekine
Akaoka Akira
Takayuki Shigeno
Yasukazu Sato
Yasushi Kawasaki
Takeshi Sekine
Akaoka Akira
Takayuki Shigeno
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