Title:
ダイヤメータ結合データを共有するための方法、システム、およびコンピュータ読取可能媒体
Document Type and Number:
Japanese Patent JP5885761
Kind Code:
B2
Abstract:
According to one aspect, the subject matter described herein includes a method for sharing Diameter binding data. The method includes receiving, by a first Diameter signaling router (DSR), a first Diameter message requiring processing. The method also includes selecting, by the first DSR, a processing element to perform the required processing from a plurality of processing elements. The method further includes routing, by the first DSR, the received first Diameter message to the selected processing element. The method further includes creating, by the first DSR, a binding record associating the selected processing element with information associated with the received first Diameter message. The method further includes communicating, by the first DSR, the binding record to a second DSR.
Inventors:
Spylog, David Michael
Kanode, Mark Edward
Marsico, Peter Jay
Kanode, Mark Edward
Marsico, Peter Jay
Application Number:
JP2013556855A
Publication Date:
March 15, 2016
Filing Date:
March 01, 2012
Export Citation:
Assignee:
TEKELEC, INC.
International Classes:
G06F13/00; H04M3/00; H04M11/00
Domestic Patent References:
| JP2013527999A |
Foreign References:
| US20100299451 | ||||
| US20110225113 | ||||
| US20120124220 |
Attorney, Agent or Firm:
Fukami patent office