Title:
金属薄膜の製造方法及び導電構造の製造方法
Document Type and Number:
Japanese Patent JP5924609
Kind Code:
B2
Abstract:
The metal thin film production method of the present invention includes, in the following order, the steps of: preparing a substrate (1) having thereon an underlayer (2) formed of an insulating resin; subjecting a surface of the underlayer (2) to a physical surface treatment for breaking bonds of organic molecules constituting the insulating resin; subjecting the substrate (1) to a heat treatment at a temperature of 200° C. or lower; applying a metal nanoparticle ink to the underlayer (2); and sintering metal nanoparticles contained in the metal nanoparticle ink at a temperature equal to or higher than a glass transition temperature of the underlayer (2). A fused layer (4) having a thickness of 100 nm or less is formed between the underlayer (2) and a metal thin film (3) formed by sintering the metal nanoparticles.
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Inventors:
Daisuke Kumaki
Tomohito Sekine
Tokito Shizushi
Kenjiro Fukuda
Tomohito Sekine
Tokito Shizushi
Kenjiro Fukuda
Application Number:
JP2015543169A
Publication Date:
May 25, 2016
Filing Date:
September 11, 2014
Export Citation:
Assignee:
Yamagata University
International Classes:
H01B13/00; B22F1/054; H01B5/14; H05K3/12; H05K3/38
Domestic Patent References:
| JP2010160989A | 2010-07-22 | |||
| JP2004143571A | 2004-05-20 | |||
| JP2009088122A | 2009-04-23 | |||
| JP2013020942A | 2013-01-31 | |||
| JP2011068815A | 2011-04-07 |
Attorney, Agent or Firm:
Koichi Kamata
Masatoshi Furuta
Masatoshi Furuta
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