半導体ウェハの処理 - Infineon Technologies AG

Title:

半導体ウェハの処理

Document Type and Number:

Japanese Patent JP6407196

Kind Code:

B2

Abstract:

A semiconductor wafer processing system for processing a semiconductor wafer is presented. The semiconductor wafer processing system comprises: a trench production apparatus configured to produce trenches in the semiconductor wafer, the trenches being arranged next to each other along a first lateral direction (X); a trench filling apparatus configured to epitaxially fill the trenches with a doped semiconductor material; and a controller operatively coupled to at least one of the trench production apparatus and the trench filling apparatus, wherein the controller is configured to control at least one of the trench production apparatus and the trench filling apparatus in dependence of a parameter, the parameter being indicative of at least one of a variation of dopant concentrations of the doped semiconductor material along the first lateral direction (X) that is to be expected when carrying out the epitaxially filling and a deviation of an expected average of the dopant concentrations from a predetermined nominal value.

Inventors:

Jens Peter Conrad
Hans-Joachim Schulze

Application Number:

JP2016096187A

Publication Date:

October 17, 2018

Filing Date:

May 12, 2016

Export Citation:

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