Title:
導電性接着剤、接合体および継手
Document Type and Number:
Japanese Patent JP6428716
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive adhesive that bonds metals together at a temperature lower than a melting point of conductive metal powder and suppresses bleeding, and to provide a joined body and a junction formed of the conductive adhesive.SOLUTION: A conductive adhesive contains 85 wt.% or more and 92 wt.% or less of conductive metal powder and the balance being a binder, where the binder contains an epoxy resin, a curing agent, an organic acid and rubber particles having a particle size of 100 nm or more and 300 nm or less, and a ratio of the rubber particles is 8 wt.% or more and 25 wt.% or less of 100 wt.% of the binder.SELECTED DRAWING: None
Inventors:
Toshio Mizowaki
Application Number:
JP2016137996A
Publication Date:
November 28, 2018
Filing Date:
July 12, 2016
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
C09J163/00; C09J9/02; C09J11/06; C09J11/08; H01B1/22
Domestic Patent References:
| JP2012532942A | ||||
| JP2014003175A | ||||
| JP2013038168A | ||||
| JP2016006819A | ||||
| JP2013144793A | ||||
| JP2014067705A |
Foreign References:
| WO2011046176A1 | ||||
| WO2015019666A1 | ||||
| WO2016031552A1 |
Attorney, Agent or Firm:
Yamaguchi International Patent Office