Title:
銅張積層板、及び銅張積層板の製造方法
Document Type and Number:
Japanese Patent JP6677448
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a copper-clad laminate which has been subjected to a rust prevention treatment, and can prevent peeling of a pattern of a photoresist even when the photoresist pattern is arranged.SOLUTION: A copper-clad laminate contains a resin film, and a copper layer having a first surface which is formed on at least one surface side of the resin film and faces the resin film and a second surface that is a surface in an opposite side to the first surface. The second surface of the copper layer has been subjected to a rust prevention treatment, and a contact angle of the second surface which has been subjected to the rust prevention treatment to pure water is 45° or more and 80° or less.SELECTED DRAWING: Figure 1
Inventors:
Takahiro Suda
Application Number:
JP2015008911A
Publication Date:
April 08, 2020
Filing Date:
January 20, 2015
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
C23F11/00; B32B15/08; H05K3/28
Domestic Patent References:
| JP2014227585A | ||||
| JP8254491A | ||||
| JP685417A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito