Title:
エポキシ樹脂、変性エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
Document Type and Number:
Japanese Patent JP6715249
Kind Code:
B2
Abstract:
Through the present embodiment, an epoxy resin and an epoxy resin composition are manufactured, whereby it is possible to obtain an epoxy resin cured material in which excellent low-moisture-absorption properties (low water absorbency) and heat resistance and strength are obtained at the same time, and the epoxy resin and epoxy resin composition are provided for electric/electronic component insulating materials such as for high-reliability semiconductor sealing, for various types of composite materials such as layered boards (printed wiring boards, BGA boards, and the like) or carbon-fiber-reinforced plastic (CFRP), and for applications such as adhesives and coating materials. An epoxy resin represented by formula (1). (In the formula, the plurality of R groups each independently represent an allyl group or a propenyl group, and 10% or more of all the R groups are propenyl groups; G represents a glycidyl group; the plurality of X groups each independently represent a hydrogen atom or a glycidyl group; and n represents a number from 0 to 10, the average value thereof being a real number from 0 to 10.)
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Inventors:
Kenichi Kubogi
Nakanishi Masataka
Kazuki Matsuura
Nakanishi Masataka
Kazuki Matsuura
Application Number:
JP2017534411A
Publication Date:
July 01, 2020
Filing Date:
August 05, 2016
Export Citation:
Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
C08G59/30; C08G59/62
Domestic Patent References:
| JP2000621A | ||||
| JP54116096A | ||||
| JP2004107501A | ||||
| JP63142019A |
Attorney, Agent or Firm:
Shinei Patent Office