電子部品実装装置 - Panasonic IP Management Co., Ltd.

Title:

電子部品実装装置

Document Type and Number:

Japanese Patent JP6799746

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus that can exclude waste of an electronic component to be discarded after it is used for trial coating when a dispenser for coating paste to the lower surface of an electronic component held by a mounting head is used, and efficiently perform a maintenance cleaning work.SOLUTION: In an electronic component mounting apparatus having a dispenser 6 for coating paste p made to fly against gravity from a discharge hole 42 opened upwards to the lower surface of an electronic component 21 taken out by a mounting head 9, a temporary use member 17 held by the mounting head 9 is used as a trial coating measuring member 17B for receiving the paste p which is experimentally made to fly from the dispenser 6, the measuring member 17B after the trial coating is subjected to image recognition to measure the coating amount of the paste p, and then the used measuring member 17B is collected in a recovery portion.SELECTED DRAWING: Figure 9

Inventors:

Koji Ikeda

Application Number:

JP2016078541A

Publication Date:

December 16, 2020

Filing Date:

April 11, 2016

Export Citation:

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