Title:
一体パッケージングプロセスベースのカメラモジュール、その一体ベース部品、およびその製造方法
Document Type and Number:
Japanese Patent JP6829259
Kind Code:
B2
Abstract:
A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.
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Inventors:
One, Minju
Jiao, Boji
Tanaka, Takehiko
Guo, Nan
Chen, Jen You
Fan, zen
Chen, Feifang
Din, Liang
Jiao, Boji
Tanaka, Takehiko
Guo, Nan
Chen, Jen You
Fan, zen
Chen, Feifang
Din, Liang
Application Number:
JP2018543321A
Publication Date:
February 10, 2021
Filing Date:
July 28, 2016
Export Citation:
Assignee:
NINGBO SUNNY OPOTECH CO.,LTD.
International Classes:
G02B7/02; G02B7/04; G03B11/00; H04N5/225
Domestic Patent References:
| JP2015099262A | ||||
| JP2006148473A | ||||
| JP2007336591A | ||||
| JP2010219696A |
Foreign References:
| WO2008102575A1 | ||||
| US20020006687 |
Attorney, Agent or Firm:
Ryoichi Takaoka
Nao Oda
Akiyo Iwahori
Kaoru Takahashi
Nao Oda
Akiyo Iwahori
Kaoru Takahashi