Title:
基板複合体及びその製造方法
Document Type and Number:
Japanese Patent JP6918341
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate complex with a first substrate and a second substrate strongly bonded via an adhesion layer.SOLUTION: A substrate complex contains a first substrate, a second substrate, and an adhesion layer that bonds together the first substrate and second substrate. The adhesion layer has a plurality of holes on a surface layer part at the second substrate side, the second substrate has a plurality of projection parts on a surface at the first substrate side, and the projection parts are positioned in the holes.SELECTED DRAWING: Figure 1
Inventors:
Akikazu Matsumoto
Application Number:
JP2017087506A
Publication Date:
August 11, 2021
Filing Date:
April 26, 2017
Export Citation:
Assignee:
Public University Corporation Osaka
International Classes:
B32B3/30; C09J5/06; C09J201/00
Domestic Patent References:
| JP2004123769A | ||||
| JP2008053467A | ||||
| JP2010083966A | ||||
| JP2014073579A |
Attorney, Agent or Firm:
Shintaro Nogawa
Shinji Kai
Yusuke Kaneko
Kiyoshi Inamoto
Shinji Kai
Yusuke Kaneko
Kiyoshi Inamoto