Title:
積層セラミック電子部品及びその製造方法
Document Type and Number:
Japanese Patent JP6923118
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component and a method of manufacturing the same.SOLUTION: A multilayer ceramic electronic component includes a ceramic body having an internal electrode and a dielectric layer, an electrode layer formed on at least one side of the ceramic body, and connected electrically with the internal electrode, and a conductive resin layer formed on the electrode layer and containing multiple metal particles and a base resin. The electrode layer has a surface formed roughly, and is connected with the conductive resin layer. Surface roughness of the electrode layer is 1 μm or more, and is 20% or less of the thickness of the electrode layer.SELECTED DRAWING: Figure 3
Inventors:
Lee, Kyung-no
Gu, Hyun Lee
Kim, Jun Hyun
Kim, Bum
Choi, Eun Joe
Gu, Hyun Lee
Kim, Jun Hyun
Kim, Bum
Choi, Eun Joe
Application Number:
JP2016077670A
Publication Date:
August 18, 2021
Filing Date:
April 07, 2016
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H01G4/30; H01G4/12
Domestic Patent References:
| JP2015046641A | ||||
| JP2015097248A | ||||
| JP60176215A | ||||
| JP2005197530A | ||||
| JP2010278601A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation