Title:
半導体増幅装置
Document Type and Number:
Japanese Patent JP6923119
Kind Code:
B2
Abstract:
An amplifier module that implements two or more amplifying units connected in series is disclosed. The amplifier module includes a package, input and output terminals, two or more amplifying units including the first unit and the final unit, an output bias terminal for supplying an output bias to one of amplifying units except for the final unit, and an input bias terminal for supplying an input bias to another one of the amplifying units except for the first unit. A feature of the amplifier module is that the output bias terminal and the input bias terminal are disposed in axial symmetry with respect to a reference axis connecting the input terminal with the output terminal in one side of the package.
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Inventors:
Miyazawa direct
Application Number:
JP2017205094A
Publication Date:
August 18, 2021
Filing Date:
October 24, 2017
Export Citation:
Assignee:
Sumitomo Electric Device Innovation Co., Ltd.
International Classes:
H03F3/195; H03F3/213
Domestic Patent References:
| JP2006080662A |
Foreign References:
| US20150048884 | ||||
| US5111157 | ||||
| US20090039966 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
High Kunio Ki
Shotaro Terasawa
Yoshiki Kuroki
High Kunio Ki
Shotaro Terasawa