Title:
ガス封入モジュール及びガス分析計
Document Type and Number:
Japanese Patent JP7281397
Kind Code:
B2
Abstract:
To provide a gas filling module and a gas analyzer that can improve adhesive strength and can suppress gas leakage without hassle.SOLUTION: A gas filling module including two gas chambers filled with gas comprises: a block-like main body; an open hole that penetrates the main body; a first transparent window, which closes the open hole in the midst of the open hole, for allowing an infrared light to pass through; an annular member adhered to the rim of one end of the open hole; and a second transparent window, which closes the opening of the annular member, for allowing the infrared light to pass through. One of the two gas chambers is a space sandwiched between the first transparent window and the second transparent window. A plurality of annular grooves surrounding the open hole is formed on at least one of the adhered parts of the main body and the annular member.SELECTED DRAWING: Figure 5
Inventors:
▲高▼橋 佑輔
Toshiya Ito
Toshiya Ito
Application Number:
JP2019238701A
Publication Date:
May 25, 2023
Filing Date:
December 27, 2019
Export Citation:
Assignee:
HORIBA, Ltd.
International Classes:
G01N21/37; G01N21/01; G01N21/61
Domestic Patent References:
| JP2003139701A | ||||
| JP2012120774A | ||||
| JP2004144520A |
Foreign References:
| US20180284012 | ||||
| US5357113 |
Attorney, Agent or Firm:
Hidehito Kono
Norio Kawano
Norio Kawano