Title:
フレーム搬送装置および半導体モジュールの製造方法
Document Type and Number:
Japanese Patent JP7412160
Kind Code:
B2
Abstract:
To provide a frame transfer device that reduces wire breakage caused by vibration during frame transfer.SOLUTION: A frame transfer device includes two rails and a chucking transfer mechanism. The two rails are placed in parallel with a spacing wider than the width of the frame. The chucking transport mechanism clamps a frame placed between the two rails and transports the frame along the two rails. Each of the two rails includes a guide inside the two rails which has a lower coefficient of friction than the body of each of the two rails.SELECTED DRAWING: Figure 2
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Inventors:
Yuji Ueno
Application Number:
JP2019231275A
Publication Date:
January 12, 2024
Filing Date:
December 23, 2019
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/60; B65G21/20; H01L21/50; H01L21/677
Domestic Patent References:
| JP57119536U | ||||
| JP8031849A | ||||
| JP7254619A | ||||
| JP2130935A | ||||
| JP60202012A | ||||
| JP9199516A | ||||
| JP8026418A | ||||
| JP2004087887A |
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita