Title:
基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP7412161
Kind Code:
B2
Abstract:
To properly remove a periphery of a first substrate in a polymerized substrate where the first substrate and a second substrate are bonded.SOLUTION: In a substrate processing apparatus for processing the substrate, a surface film is formed on a surface of the substrate, the substrate processing apparatus has a periphery modification section that radiates a laser beam inside the first substrate to form a periphery modification layer that serves as a base point for peeling of the periphery along a boundary between the periphery and a center of the substrate to be removed, in a polymerized substrate where a first substrate and a second substrate are bonded together, and a substrate exposure area that exposes the surface of the first substrate by removing the surface film is formed on the periphery of the first substrate.SELECTED DRAWING: Figure 7
Inventors:
Hayato Tanoue
Yohei Yamawaki
Yohei Yamashita
Seiji Nakano
Hiroaki Mori
Yohei Yamawaki
Yohei Yamashita
Seiji Nakano
Hiroaki Mori
Application Number:
JP2019231786A
Publication Date:
January 12, 2024
Filing Date:
December 23, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304; B23K26/53; B24B7/04
Domestic Patent References:
| JP2017055089A | ||||
| JP2016004799A |
Foreign References:
| WO2019208298A1 |
Attorney, Agent or Firm:
Tetsuo Kanemoto
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine